Available technologies, Electrical and Electronic components, Engineering, Information and communications technology (ICT), Signal and Data Processing, Telecommunication

SELF-PACKAGED LOW LOSS SUBSTRATE INTEGRATED AIR-FILLED WAVEGUIDE

Completely self-packaged integrated guiding medium with contactless waveguide layers and low- loss performance at millimeter-wave frequencies

The need and challenge in high data rate communication systems   

  • The millimeter wave technology market is expected to reach USD 2,3 Billion in 2023
  • The rapid development of millimeter-wave applications including high-speed wireless data links, short-range radars, and high-resolution imaging has increased demands for low cost and high performance integrated circuits
  • As the conventional circular and rectangular hollow waveguides cannot be easily integrated with the circuits, the invention of substrate integrated waveguide (SIW) technology has been a promising start to satisfy these demands
  • The SIW technology has received considerable attention over the last decade because of its lightweight, low cost, and compactness
  • However, for the applications at high frequencies, which are more desired for upcoming communication devices, the conventional SIW circuits are suffering from unexpected dielectric losses

New design/method for Contactless Air-Filled Substrate Integrated Waveguide (CLAF-SIW)

  • A new waveguide design configuration has been developed which provides a low loss air propagation medium for the integrated circuits
  • This air-filled integrated guiding structure is completely isolated and self-packaged, and can be used to design low insertion loss substrate integrated circuit components at millimeter-wave and submillimeter-wave frequencies
  • The components incorporating this integrated guiding structure show higher average power handling capability (APHC) compared with the components made with traditional SIW structure.
  • Moreover, this integrated low loss waveguide does not need any expensive and strict connection of the layers, even at very high frequencies, since its innovative geometry completely isolates the guiding medium
  • Technology developed by Prof. Ahmed Kishk and Nima Bayat-Makou (Electrical and Computer Engineering, Concordia University)

Competitive advantages

  • Low loss at millimeter-wave and submillimeter-wave frequencies
  • Completely self-packaged integrated guiding medium with contactless waveguide layers
  • Low-cost fabrication process and easy connection of the waveguide layers
  • High average power handling capability

Market applications 

  • High data rate future communication systems
  • High-frequency antenna feed networks

Business opportunity

  • PCT has been filed on May 2018
  • Technology available for licensing

CONTACT

If you are interested by this technology, please contact :
Pierre des Lierres, Director Business Development, Engineering
PdesLierres@aligo.ca, (514) 571-6556

UNIVERSITY

Concordia University

Main inventors

kishk

Ahmed Kishk, Professor, Electrical and Computer Engineering

Prof. Ahmed Kishk received the M.Eng. and Ph.D. degrees from the Department of Electrical Engineering, University of Manitoba, Winnipeg, MB, Canada, in 1983 and 1986, respectively. In 1981, he joined the Department of Electrical Engineering, University of Manitoba. He was the Chair of the Physics and Engineering Division, Mississippi Academy of Science, Jackson, MS, USA, from 2001 to 2002. Since 2011, he has been the Trier 1 Canada Research Chair in Advanced Antenna Systems. He is currently a Professor with Concordia University, Montréal, QC, Canada. Dr. Kishk was a Distinguish Lecturer of the Antennas and Propagation Society from 2013 to 2015. From 1990 to 1993, he was an Associate Editor of the IEEE Antennas and Propagation Magazine. He was an Editor of the IEEE Antennas and Propagation Magazine from 1993 to 2014. He was a Co-Editor of the “Special Issue on Advances in the Application of the Method of Moments to Electromagnetic Scattering Problems” of the ACES Journal. He was also an Editor and the Editor-in-Chief of the ACES Journal in 1997 and from 1998 to 2001, respectively

nima

Nima Bayat-Makou, Researcher, Electrical and Computer Engineering

Nima Bayat-Makou received the B.Sc. degree in electrical and telecommunications engineering from IAU, Urmia, Iran, in 2006, the M.Sc. degree in electrical and telecommunications engineering from the Science and Research Branch, IAU, in 2010, and the Ph.D. degree in electrical and computer engineering from Concordia University, Montreal, QC, Canada, in 2017.From 2013 to 2017, he was a Research and Teaching Assistant with Concordia University. He is currently a Post-Doctoral Fellow with the PolyGrames Research Center, Polytechnique Montreal, University of Montreal. Dr. Bayat-Makou was a recipient of the Young Scientist Award presented at the 2017 URSI General Assembly and the Second Prize of the 2017 STARaCom Poster Competition. He has served as a Reviewer for the IEEE Antennas and Propagation Society’s journals and magazine